Xiaomi’s Global spokesperson Donovan Sung have teased a new high-end variant of its upcoming Mi 9 smartphone. The Mi 9 is set for a release date on February 20 in China and February 24 globally at MWC 2019. Donovan earlier today shared an image of a new Mi 9 device that will come with Snapdragon 855 chipset. The new Mi 9 appears to have a transparent back panel, as we have seen on the Mi 8 explorer edition.
Notably, a similar Mi 9 device with a transparent back panel was leaked yesterday. However, the previous image has suggested the device to come with a quad camera setup. But the image Donovan has shared today, confirms that the device would be a high-end variant of the regular Mi 9 smartphone with a transparent back panel.
— Donovan Sung (@donovansung) February 15, 2019
The image also reveals the device featuring a triple rear camera setup similar to the regular version of the Mi 9. However, Donovan Sung didn’t share any other details about the new Mi 9.
He did confirm that the new Mi 9 will be powered by Qualcomm’s Snapdragon 855 chipset and will sport a triple rear camera set up at the back. The camera configuration is also not known as yet.